ZHCS141E August 2011 – Oct 2019 TS3DS10224
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TS3DS10224 | UNIT | |
|---|---|---|---|
| RUK (WQFN) | |||
| 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 45.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 48.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 17.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 17.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.7 | °C/W |