ZHCSRQ4 august 2023 TPSM8S6C24
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 說明（續(xù)）
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Average Current-Mode Control
- 8.3.2 Linear Regulators
- 8.3.3 AVIN and PVIN Pins
- 8.3.4 Input Undervoltage Lockout (UVLO)
- 8.3.5 Start-Up and Shutdown
- 8.3.6 Differential Sense Amplifier and Feedback Divider
- 8.3.7 Set Output Voltage and Adaptive Voltage Scaling (AVS)
- 8.3.8 Prebiased Output Start-Up
- 8.3.9 Soft Stop and (65h) TOFF_FALL Command
- 8.3.10 Power Good (PGOOD)
- 8.3.11 Set Switching Frequency
- 8.3.12 Frequency Synchronization
- 8.3.13 Loop Follower Detection
- 8.3.14 Current Sensing and Sharing
- 8.3.15 Telemetry
- 8.3.16 Overcurrent Protection
- 8.3.17 Overvoltage, Undervoltage Protection
- 8.3.18 Overtemperature Management
- 8.3.19 Fault Management
- 8.3.20 Back-Channel Communication
- 8.3.21 Switching Node (SW)
- 8.3.22 PMBus General Description
- 8.3.23 PMBus Address
- 8.3.24 PMBus Connections
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1 Conventions for Documenting Block Commands
- 8.6.2 (01h) OPERATION
- 8.6.3 (02h) ON_OFF_CONFIG
- 8.6.4 (03h) CLEAR_FAULTS
- 8.6.5 (04h) PHASE
- 8.6.6 (10h) WRITE_PROTECT
- 8.6.7 (15h) STORE_USER_ALL
- 8.6.8 (16h) RESTORE_USER_ALL
- 8.6.9 (19h) CAPABILITY
- 8.6.10 (1Bh) SMBALERT_MASK
- 8.6.11 (1Bh) SMBALERT_MASK_VOUT
- 8.6.12 (1Bh) SMBALERT_MASK_IOUT
- 8.6.13 (1Bh) SMBALERT_MASK_INPUT
- 8.6.14 (1Bh) SMBALERT_MASK_TEMPERATURE
- 8.6.15 (1Bh) SMBALERT_MASK_CML
- 8.6.16 (1Bh) SMBALERT_MASK_OTHER
- 8.6.17 (1Bh) SMBALERT_MASK_MFR
- 8.6.18 (20h) VOUT_MODE
- 8.6.19 (21h) VOUT_COMMAND
- 8.6.20 (22h) VOUT_TRIM
- 8.6.21 (24h) VOUT_MAX
- 8.6.22 (25h) VOUT_MARGIN_HIGH
- 8.6.23 (26h) VOUT_MARGIN_LOW
- 8.6.24 (27h) VOUT_TRANSITION_RATE
- 8.6.25 (29h) VOUT_SCALE_LOOP
- 8.6.26 (2Bh) VOUT_MIN
- 8.6.27 (33h) FREQUENCY_SWITCH
- 8.6.28 (35h) VIN_ON
- 8.6.29 (36h) VIN_OFF
- 8.6.30 (37h) INTERLEAVE
- 8.6.31 (38h) IOUT_CAL_GAIN
- 8.6.32 (39h) IOUT_CAL_OFFSET
- 8.6.33 (40h) VOUT_OV_FAULT_LIMIT
- 8.6.34 (41h) VOUT_OV_FAULT_RESPONSE
- 8.6.35 (42h) VOUT_OV_WARN_LIMIT
- 8.6.36 (43h) VOUT_UV_WARN_LIMIT
- 8.6.37 (44h) VOUT_UV_FAULT_LIMIT
- 8.6.38 (45h) VOUT_UV_FAULT_RESPONSE
- 8.6.39 (46h) IOUT_OC_FAULT_LIMIT
- 8.6.40 (47h) IOUT_OC_FAULT_RESPONSE
- 8.6.41 (4Ah) IOUT_OC_WARN_LIMIT
- 8.6.42 (4Fh) OT_FAULT_LIMIT
- 8.6.43 (50h) OT_FAULT_RESPONSE
- 8.6.44 (51h) OT_WARN_LIMIT
- 8.6.45 (55h) VIN_OV_FAULT_LIMIT
- 8.6.46 (56h) VIN_OV_FAULT_RESPONSE
- 8.6.47 (58h) VIN_UV_WARN_LIMIT
- 8.6.48 (60h) TON_DELAY
- 8.6.49 (61h) TON_RISE
- 8.6.50 (62h) TON_MAX_FAULT_LIMIT
- 8.6.51 (63h) TON_MAX_FAULT_RESPONSE
- 8.6.52 (64h) TOFF_DELAY
- 8.6.53 (65h) TOFF_FALL
- 8.6.54 (78h) STATUS_BYTE
- 8.6.55 (79h) STATUS_WORD
- 8.6.56 (7Ah) STATUS_VOUT
- 8.6.57 (7Bh) STATUS_IOUT
- 8.6.58 (7Ch) STATUS_INPUT
- 8.6.59 (7Dh) STATUS_TEMPERATURE
- 8.6.60 (7Eh) STATUS_CML
- 8.6.61 (7Fh) STATUS_OTHER
- 8.6.62 (80h) STATUS_MFR_SPECIFIC
- 8.6.63 (88h) READ_VIN
- 8.6.64 (8Bh) READ_VOUT
- 8.6.65 (8Ch) READ_IOUT
- 8.6.66 (8Dh) READ_TEMPERATURE_1
- 8.6.67 (98h) PMBUS_REVISION
- 8.6.68 (99h) MFR_ID
- 8.6.69 (9Ah) MFR_MODEL
- 8.6.70 (9Bh) MFR_REVISION
- 8.6.71 (9Eh) MFR_SERIAL
- 8.6.72 (ADh) IC_DEVICE_ID
- 8.6.73 (AEh) IC_DEVICE_REV
- 8.6.74 (B1h) USER_DATA_01 (COMPENSATION_CONFIG)
- 8.6.75 (B5h) USER_DATA_05 (POWER_STAGE_CONFIG)
- 8.6.76 (D0h) MFR_SPECIFIC_00 (TELEMETRY_CONFIG)
- 8.6.77 (DAh) MFR_SPECIFIC_10 (READ_ALL)
- 8.6.78 (DBh) MFR_SPECIFIC_11 (STATUS_ALL)
- 8.6.79 (DCh) MFR_SPECIFIC_12 (STATUS_PHASE)
- 8.6.80 (E3h) MFR_SPECIFIC_19 (PGOOD_CONFIG)
- 8.6.81 (E4h) MFR_SPECIFIC_20 (SYNC_CONFIG)
- 8.6.82 (ECh) MFR_SPECIFIC_28 (STACK_CONFIG)
- 8.6.83 (EDh) MFR_SPECIFIC_29 (MISC_OPTIONS)
- 8.6.84 (EEh) MFR_SPECIFIC_30 (PIN_DETECT_OVERRIDE)
- 8.6.85 (EFh) MFR_SPECIFIC_31 (DEVICE_ADDRESS)
- 8.6.86 (F0h) MFR_SPECIFIC_32 (NVM_CHECKSUM)
- 8.6.87 (F1h) MFR_SPECIFIC_33 (SIMULATE_FAULT)
- 8.6.88 (FAh) MFR_SPECIFIC_42 (PASSKEY)
- 8.6.89 (FBh) MFR_SPECIFIC_43 (EXT_WRITE_PROTECT)
- 8.6.90 (FCh) MFR_SPECIFIC_44 (FUSION_ID0)
- 8.6.91 (FDh) MFR_SPECIFIC_45 (FUSION_ID1)
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH? Tools
- 9.2.2.2 Switching Frequency
- 9.2.2.3 Output Voltage Setting (VSEL Pin)
- 9.2.2.4 Compensation Selection (MSEL1 Pin)
- 9.2.2.5 Output Capacitor Selection
- 9.2.2.6 Input Capacitor Selection
- 9.2.2.7 Soft Start, Overcurrent Protection, and Stacking Configuration (MSEL2 Pin)
- 9.2.2.8 Enable and UVLO
- 9.2.2.9 ADRSEL
- 9.2.2.10 BCX_CLK and BCX_DAT
- 9.2.3 Application Curves
- 9.2.4
Two-Phase Application
- 9.2.4.1 Design Requirements
- 9.2.4.2
Two-Phase Detailed Design Procedure
- 9.2.4.2.1 Switching Frequency
- 9.2.4.2.2 Output Voltage Setting (VSEL Pin)
- 9.2.4.2.3 Compensation Selection (MSEL1 Pin)
- 9.2.4.2.4 Output Capacitor Selection
- 9.2.4.2.5 Input Capacitor Selection
- 9.2.4.2.6 GOSNS/Loop Follower Pin of Loop Follower Devices
- 9.2.4.2.7 Soft Start, Overcurrent Protection, and Stacking Configuration (MSEL2 Pin)
- 9.2.4.2.8 Enable, UVLO
- 9.2.4.2.9 VSHARE Pin
- 9.2.4.2.10 SYNC Pin
- 9.2.4.2.11 VOSNS Pin of Loop Follower Devices
- 9.2.4.2.12 Unused Pins of Loop Follower Devices
- 9.2.4.3 Two-Phase Application Curves
- 9.3 Power Supply Recommendations
- 9.4 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- MOY|45
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
3 說明
TPSM8S6C24 是一款高度集成、易于使用的非隔離式直流/直流降壓電源模塊，添加了特定于制造商的 PMBus 命令。附加的 EXTENDED_WRITE_PROTECT 和 PASSKEY 可通過使用比標(biāo)準(zhǔn)寫保護(hù)命令更高的分辨率限制寫入能力來防止對(duì) PMBus 的惡意訪問，從而提高安全性。
TPSM8S6C24 是一款 35A 電源模塊，可拉出高達(dá) 140A 的電流，具有 4 倍堆疊能力。該器件可通過外部 5V 電源對(duì)內(nèi)部的 5V LDO 進(jìn)行過驅(qū)動(dòng)，以實(shí)現(xiàn)低至 2.95V 的較低輸入電壓范圍并提高轉(zhuǎn)換器的效率。
TPSM8S6C24 電源模塊使用專有的固定頻率電流模式控制，具有輸入前饋和可選的內(nèi)部補(bǔ)償元件，可在各種輸出電容下最大限度減小尺寸和提高穩(wěn)定性。
(1) 如需了解所有可用封裝，請(qǐng)參閱數(shù)據(jù)表末尾的可訂購產(chǎn)品附錄。
(2) 封裝尺寸（長 × 寬）為標(biāo)稱值，并包括引腳（如適用）。
簡化版應(yīng)用
效率