ZHCSO36A april 2023 – july 2023 TPS7A96
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Output Voltage Setting and Regulation
- 7.3.2 Ultra-Low Noise and Ultra-High Power-Supply Rejection Ratio (PSRR)
- 7.3.3 Programmable Current Limit and Power-Good Threshold
- 7.3.4 Programmable Soft-Start (NR/SS Pin)
- 7.3.5 Precision Enable and UVLOs
- 7.3.6 Active Discharge
- 7.3.7 Thermal Shutdown Protection (TSD)
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1
Application Information
- 8.1.1 Output Voltage Restart (Overshoot Prevention Circuit)
- 8.1.2 Precision Enable (External UVLO)
- 8.1.3 Undervoltage Lockout (UVLO) Operation
- 8.1.4 Dropout Voltage (VDO)
- 8.1.5 Power-Good Feedback (FB_PG Pin) and Power-Good Threshold (PG Pin)
- 8.1.6 Adjusting the Factory-Programmed Current Limit
- 8.1.7 Programmable Soft-Start and Noise-Reduction (NR/SS Pin)
- 8.1.8 Inrush Current
- 8.1.9 Optimizing Noise and PSRR
- 8.1.10 Adjustable Operation
- 8.1.11 Paralleling for Higher Output Current and Lower Noise
- 8.1.12 Recommended Capacitor Types
- 8.1.13 Load Transient Response
- 8.1.14 Power Dissipation (PD)
- 8.1.15 Estimating Junction Temperature
- 8.1.16 TPS7A96EVM-106 Thermal Analysis
- 8.2 Typical Application
- 8.3 Power Supply Recommendations
- 8.4 Layout
- 8.1
Application Information
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- DSC|10
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- DSC|10
訂購信息
8.1.14 Power Dissipation (PD)
Circuit reliability demands that proper consideration be given to device power dissipation, location of the circuit on the printed circuit board (PCB), and correct sizing of the thermal plane. The PCB area around the regulator must be as free as possible of other heat-generating devices that cause added thermal stresses.
As a first-order approximation, power dissipation in the regulator depends on the input-to-output voltage difference and load conditions. Equation 12 calculates PD:
Power dissipation can be minimized, and thus greater efficiency achieved, by proper selection of the system voltage rails. Proper selection allows the minimum input-to-output voltage differential to be obtained. The low dropout of the device allows for maximum efficiency across a wide range of output voltages.
The primary heat conduction path for the package is through the thermal pad to the PCB. Solder the thermal pad to a copper pad area under the device. This pad area contains an array of plated vias that conduct heat to any inner plane areas or to a bottom-side copper plane.
The power dissipation by the device determines the junction temperature (TJ) for the device. Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to Equation 13. This equation is rearranged for output current in Equation 14.
This thermal resistance (RθJA) is highly dependent on the heat-spreading capability built into the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded in the Thermal Information table is determined by the JEDEC standard, PCB, and copper-spreading area, and is only used as a relative measure of package thermal performance. For a well-designed thermal layout, RθJA is actually the sum of the DSC package junction-to-case (bottom) thermal resistance (RθJCbot) plus the thermal resistance contribution by the PCB copper.