ZHCSO36A april 2023 – july 2023 TPS7A96
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Output Voltage Setting and Regulation
- 7.3.2 Ultra-Low Noise and Ultra-High Power-Supply Rejection Ratio (PSRR)
- 7.3.3 Programmable Current Limit and Power-Good Threshold
- 7.3.4 Programmable Soft-Start (NR/SS Pin)
- 7.3.5 Precision Enable and UVLOs
- 7.3.6 Active Discharge
- 7.3.7 Thermal Shutdown Protection (TSD)
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1
Application Information
- 8.1.1 Output Voltage Restart (Overshoot Prevention Circuit)
- 8.1.2 Precision Enable (External UVLO)
- 8.1.3 Undervoltage Lockout (UVLO) Operation
- 8.1.4 Dropout Voltage (VDO)
- 8.1.5 Power-Good Feedback (FB_PG Pin) and Power-Good Threshold (PG Pin)
- 8.1.6 Adjusting the Factory-Programmed Current Limit
- 8.1.7 Programmable Soft-Start and Noise-Reduction (NR/SS Pin)
- 8.1.8 Inrush Current
- 8.1.9 Optimizing Noise and PSRR
- 8.1.10 Adjustable Operation
- 8.1.11 Paralleling for Higher Output Current and Lower Noise
- 8.1.12 Recommended Capacitor Types
- 8.1.13 Load Transient Response
- 8.1.14 Power Dissipation (PD)
- 8.1.15 Estimating Junction Temperature
- 8.1.16 TPS7A96EVM-106 Thermal Analysis
- 8.2 Typical Application
- 8.3 Power Supply Recommendations
- 8.4 Layout
- 8.1
Application Information
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSC|10
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSC|10
訂購(gòu)信息
8.1.15 Estimating Junction Temperature
The JEDEC standard now recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures of the LDO when in-circuit on a typical PCB board application. These metrics are not strictly speaking thermal resistances, but rather offer practical and relative means of estimating junction temperatures. These psi metrics are determined to be significantly independent of the copper-spreading area. The key thermal metrics (ΨJT and ΨJB) are used in accordance with Equation 15 and are given in the Thermal Information table.
where:
- PD is the power dissipated as explained in the Power Dissipation (PD) section
- TT is the temperature at the center-top of the device package
- TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge