ZHCSP75A July 2022 – December 2022 TPS1HC30-Q1
PRODUCTION DATA
| THERMAL METRIC(1)(2) | TPS1HC30-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 44.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 33.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 19.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 19.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.0 | °C/W |