ZHCSLK6B July 2021 – February 2025 TPS1HC100-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Parameter Measurement Information
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Accurate Current Sense
- 7.3.2 Programmable Current Limit
- 7.3.3 Inductive-Load Switching-Off Clamp
- 7.3.4
Full Protections and Diagnostics
- 7.3.4.1 Short-Circuit and Overload Protection
- 7.3.4.2 Open-Load and Short-to-Battery Detection
- 7.3.4.3 Short-to-Battery Detection
- 7.3.4.4 Reverse-Polarity and Battery Protection
- 7.3.4.5 Latch-Off Mode
- 7.3.4.6 Thermal Protection Behavior
- 7.3.4.7 UVLO Protection
- 7.3.4.8 Loss of GND Protection
- 7.3.4.9 Loss of Power Supply Protection
- 7.3.4.10 Reverse Current Protection
- 7.3.4.11 Protection for MCU I/Os
- 7.3.5 Diagnostic Enable Function
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- PWP|14
散熱焊盤機械數據 (封裝 | 引腳)
- PWP|14
訂購信息
8.4.2.1 Without a GND Network
Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.
Figure 8-8 Layout Without a GND
Network