ZHCSGV4J September 2017 – November 2024 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information (Single)
- 5.5 Thermal Information (Dual)
- 5.6 Thermal Information (Quad)
- 5.7 Electrical Characteristics (Single)
- 5.8 Switching Characteristics (Single)
- 5.9 Electrical Characteristics (Dual)
- 5.10 Switching Characteristics (Dual)
- 5.11 Electrical Characteristics (Quad)
- 5.12 Switching Characteristics (Quad)
- 5.13 Timing Diagrams
- 5.14 Typical Characteristics
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTE|16
訂購信息
8.6 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |