ZHCSMM9A December   2020  – June 2021 TLV320ADC6120

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Electrical Characteristics
   6. 7.6  Timing Requirements:?I2C Interface
   7. 7.7  Switching Characteristics: I2C Interface
   8. 7.8  Timing Requirements:?TDM, I2S or LJ Interface
   9. 7.9  Switching Characteristics: TDM, I2S or LJ Interface
   10. 7.10 Timing Requirements:?PDM Digital Microphone Interface
   11. 7.11 Switching Characteristics: PDM Digital Microphone Interface
   12. 7.12 Timing Diagrams
   13. 7.13 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  Serial Interfaces
         1. 8.3.1.1 Control Serial Interfaces
         2. 8.3.1.2 Audio Serial Interfaces
            1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
            2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
            3. 8.3.1.2.3 Left-Justified (LJ) Interface
         3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3  Input Channel Configurations
      4. 8.3.4  Reference Voltage
      5. 8.3.5  Programmable Microphone Bias
      6. 8.3.6  Signal-Chain Processing
         1. 8.3.6.1 Programmable Channel Gain and Digital Volume Control
         2. 8.3.6.2 Programmable Channel Gain Calibration
         3. 8.3.6.3 Programmable Channel Phase Calibration
         4. 8.3.6.4 Programmable Digital High-Pass Filter
         5. 8.3.6.5 Programmable Digital Biquad Filters
         6. 8.3.6.6 Programmable Channel Summer and Digital Mixer
         7. 8.3.6.7 Configurable Digital Decimation Filters
            1. 8.3.6.7.1 Linear Phase Filters
               1. 8.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
               2. 8.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
               3. 8.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
               4. 8.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
               5. 8.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
               6. 8.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
               7. 8.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
               8. 8.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
               9. 8.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
            2. 8.3.6.7.2 Low-Latency Filters
               1. 8.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
               2. 8.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
               3. 8.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
               4. 8.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
               5. 8.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
               6. 8.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
            3. 8.3.6.7.3 Ultra-Low Latency Filters
               1. 8.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
               2. 8.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
               3. 8.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
               4. 8.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
               5. 8.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
               6. 8.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
               7. 8.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 8.3.7  Dynamic Range Enhancer (DRE)
      8. 8.3.8  Dynamic Range Compressor (DRC)
      9. 8.3.9  Automatic Gain Controller (AGC)
      10. 8.3.10 Voice Activity Detection (VAD)
      11. 8.3.11 Digital PDM Microphone Record Channel
      12. 8.3.12 Interrupts, Status, and Digital I/O Pin Multiplexing
   4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode or Software Shutdown
      2. 8.4.2 Active Mode
      3. 8.4.3 Software Reset
   5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
         1. 8.5.1.1 I2C Control Interface
            1. 8.5.1.1.1 General I2C Operation
            2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
               1. 8.5.1.1.2.1 I2C Single-Byte Write
               2. 8.5.1.1.2.2 I2C Multiple-Byte Write
               3. 8.5.1.1.2.3 I2C Single-Byte Read
               4. 8.5.1.1.2.4 I2C Multiple-Byte Read
   6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
         1. 8.6.1.1 TLV320ADC6120 Access Codes
      2. 8.6.2 Page 0 Registers
      3. 8.6.3 Page 1 Registers
      4. 8.6.4 Programmable Coefficient Registers
         1. 8.6.4.1 Programmable Coefficient Registers: Page 2
         2. 8.6.4.2 Programmable Coefficient Registers: Page 3
         3. 8.6.4.3 Programmable Coefficient Registers: Page 4
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Two-Channel Analog Microphone Recording
         1. 9.2.1.1 Design Requirements
         2. 9.2.1.2 Detailed Design Procedure
            1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
         3. 9.2.1.3 Application Curves
      2. 9.2.2 Four-Channel Digital PDM Microphone Recording
         1. 9.2.2.1 Design Requirements
         2. 9.2.2.2 Detailed Design Procedure
            1. 9.2.2.2.1 Example Device Register Configuration Script for EVM Setup
   3. 9.3 What to Do and What Not to Do
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 Documentation Support
       1. 12.1.1 Related Documentation
    2. 12.2 接收文檔更新通知
    3. 12.3 支持資源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 術(shù)語(yǔ)表
13. 13Mechanical, Packaging, and Orderable Information