ZHCSMM9A December 2020 – June 2021 TLV320ADC6120
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics
- 7.6 Timing Requirements:?I2C Interface
- 7.7 Switching Characteristics: I2C Interface
- 7.8 Timing Requirements:?TDM, I2S or LJ Interface
- 7.9 Switching Characteristics: TDM, I2S or LJ Interface
- 7.10 Timing Requirements:?PDM Digital Microphone Interface
- 7.11 Switching Characteristics: PDM Digital Microphone Interface
- 7.12 Timing Diagrams
- 7.13 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Serial Interfaces
- 8.3.2 Phase-Locked Loop (PLL) and Clock Generation
- 8.3.3 Input Channel Configurations
- 8.3.4 Reference Voltage
- 8.3.5 Programmable Microphone Bias
- 8.3.6
Signal-Chain Processing
- 8.3.6.1 Programmable Channel Gain and Digital Volume Control
- 8.3.6.2 Programmable Channel Gain Calibration
- 8.3.6.3 Programmable Channel Phase Calibration
- 8.3.6.4 Programmable Digital High-Pass Filter
- 8.3.6.5 Programmable Digital Biquad Filters
- 8.3.6.6 Programmable Channel Summer and Digital Mixer
- 8.3.6.7
Configurable Digital Decimation Filters
- 8.3.6.7.1
Linear Phase Filters
- 8.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
- 8.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
- 8.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
- 8.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
- 8.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
- 8.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
- 8.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
- 8.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
- 8.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
- 8.3.6.7.2 Low-Latency Filters
- 8.3.6.7.3
Ultra-Low Latency Filters
- 8.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
- 8.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
- 8.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
- 8.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
- 8.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
- 8.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
- 8.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
- 8.3.6.7.1
Linear Phase Filters
- 8.3.7 Dynamic Range Enhancer (DRE)
- 8.3.8 Dynamic Range Compressor (DRC)
- 8.3.9 Automatic Gain Controller (AGC)
- 8.3.10 Voice Activity Detection (VAD)
- 8.3.11 Digital PDM Microphone Record Channel
- 8.3.12 Interrupts, Status, and Digital I/O Pin Multiplexing
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6 Register Maps
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTE|20
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
6 Pin Configuration and Functions
Figure 6-1 RTE
Package,20-Pin WQFN With Exposed Thermal
Pad,Top ViewTable 6-1 Pin Functions
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | IN1P | Analog input | Analog input 1P pin. |
| 2 | IN1M | Analog input | Analog input 1M pin. |
| 3 | IN2P_GPI1 | Analog input/digital input | Analog input 2P pin or general-purpose digital input 1 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth). |
| 4 | IN2M_GPO1 | Analog input/digital output | Analog input 2M pin or general-purpose digital output 1 (multipurpose functions such as digital microphone clock, interrupt, and so forth). |
| 5 | VSS | Ground supply | Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions. |
| 6 | SDOUT | Digital output | Audio serial data interface bus output. |
| 7 | BCLK | Digital I/O | Audio serial data interface bus bit clock. |
| 8 | FSYNC | Digital I/O | Audio serial data interface bus frame synchronization signal. |
| 9 | IOVDD | Digital supply | Digital I/O power supply (1.8 V or 3.3 V, nominal). |
| 10 | VSS | Ground supply | Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions. |
| 11 | GPIO1 | Digital I/O | General-purpose digital input/output 1 (multipurpose functions such as digital microphones clock or data, PLL input clock source, interrupt, and so forth). |
| 12 | SDA | Digital I/O | Data pin for I2C control bus. |
| 13 | SCL | Digital input | Clock pin for I2C control bus. |
| 14 | DREG | Digital supply | Digital regulator output voltage for digital core supply (1.5 V, nominal). Connect a 10-μF and 0.1-μF low ESR capacitor in parallel to device ground (VSS). |
| 15 | VSS | Ground supply | Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions. |
| 16 | AVDD | Analog supply | Analog power (1.8 V or 3.3 V, nominal). |
| 17 | AREG | Analog supply | Analog on-chip regulator output voltage for analog supply (1.8 V, nominal) or external analog power (1.8 V, nominal). Connect a 10-μF and 0.1-μF low ESR capacitor in parallel to analog ground (AVSS). |
| 18 | VREF | Analog | Analog reference voltage filter output. Connect a 1-μF capacitor to analog ground (AVSS). |
| 19 | MICBIAS_GPI2 | Analog output/digital input | MICBIAS output or general-purpose digital input 2 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth). If used as MICBIAS output, then connect a 1-μF capacitor to analog ground (AVSS). |
| 20 | VSS | Ground supply | Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions. |
| Thermal Pad | Thermal Pad (VSS) | Ground supply | Thermal pad shorted to internal device ground. Short the thermal pad directly to the board ground plane. |