ZHCSPI8D November 2021 – July 2022 TLC6984
PRODUCTION DATA
| THERMAL METRIC(1) | TLC6984 | UNIT | ||
|---|---|---|---|---|
| RRF (VQFN) | ZXL (BGA) | |||
| 76 PINS | 96 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 22.2 | 33.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 10.7 | 18.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.2 | 11.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 7.1 | 11.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | °C/W | |