ZHCSGQ0A September 2017 – February 2022 TIC10024-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TIC10024-Q1 | UNIT | |
|---|---|---|---|
| DCP (TSSOP) | |||
| 38 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 33.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 15.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.2 | °C/W |