ZHCSK26E March 2017 – July 2022 LMH1297
PRODUCTION DATA
| THERMAL METRIC(1) | LMH1297 | UNIT | |
|---|---|---|---|
| RTV (QFN) | |||
| 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 32.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 15.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 6.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 6.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | °C/W |