ZHCSIT4B September 2018 – April 2024 LM5164-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LM5164-Q1 | UNIT | |
|---|---|---|---|
| DDA (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 41.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 37.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 30.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 6.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 24.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.4 | °C/W |