ZHCSG37C September 2016 – December 2022 DS90UB934-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DS90UB934-Q1 | UNIT | |
|---|---|---|---|
| RGZ (VQFN) | |||
| 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 30.3 | °C/W |
| RθJC(TOP) | Junction-to-case (top) thermal resistance | 12.3 | °C/W |
| RθJC(BOT) | Junction-to-case (bottom) thermal resistance | 1.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 6.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 6.8 | °C/W |