ZHCSME1C August 2018 – June 2021 DS250DF230
PRODUCTION DATA
| THERMAL METRIC(1) | CONDITIONS(2) | DS250DF230ZLS | DS250DF230RTV | UNIT | |
|---|---|---|---|---|---|
| ZLS (NFBGA) | RTV (QFN) | ||||
| 36 PINS | 32 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 4-layer JEDEC board | 49.3 | 30.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 4-layer JEDEC board | 20.7 | 17.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 4-layer JEDEC board | 24.5 | 10.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4-layer JEDEC board | 0.5 | 0.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 4-layer JEDEC board | 24.7 | 10.6 | °C/W |
| RθJC(bot) | Junction-to-case (bot) thermal resistance | 4-layer JEDEC board | -- | 1.8 | °C/W |