ZHCS276F September 2011 – February 2025 DRV8818
PRODUCTION DATA
Bypass the VMA and VMB pins to GND using low-ESR ceramic bypass capacitors with a recommended value of 0.1μF rated for VM. Place this capacitor as close to the VMA and VMB pins as possible with a thick trace or ground plane connection to the device GND pin.
Bypass the VMA and VMB pins to GND using an appropriate bulk capacitor. This component is often an electrolytic and is best located close to the DRV8818.
A low-ESR ceramic capacitor must be placed in between the CP1 and CP2 pins. TI recommends a value of 0.22μF rated for VM. Place this component as close to the pins as possible.
A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. TI recommends a value of 0.22μF rated for 16V. Place this component as close to the pins as possible.
The PowerPAD must be securely connected to a copper plane that is connected to system GND. For best performance, use a copper place with a large area to allow for thermal dissipation from the DRV8818A. See Application Note - Best Practices for Board Layout of Motor Drivers for more information on thermal management, routing techniques, capacitor placement, and grounding optimization for motor drivers.