ZHCSCS1D June 2014 – November 2020 DRV8801A-Q1
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, And Orderable Information
8.2.3.1 Junction-to-Ambiant Thermal Impedance (?JA)
At any given time during the steady state portion of the cycle, two FETs are enabled: A high side sourcing FET and a low side sinking FET. The increase in die temperature above ambient can be estimated by Equation 5
Equation 5. 