ZHCSHA0E January 2018 – March 2021 DRV10974
PRODUCTION DATA
| PIN | I/O | TYPE(1) | DESCRIPTION | ||
|---|---|---|---|---|---|
| NAME. | NO. | ||||
| HTSSOP | WQFN | ||||
| ADV | 1 | 15 | I | D | Selects the applied lead angle by 1/8-W resistor; not to be driven externally with a source; leaving the pin open results in the longest lead angle; the lead angle is determined by the ADV pin voltage at power up. |
| CS | 8 | 6 | I | D | Selects current limit by 1/8-W resistor; not to be driven externally with a source; leaving the pin open results in the highest current limit; the current limit is determined by the CS pin voltage at power up. |
| FG | 3 | 1 | O | D | Provides motor speed feedback; open-drain output with internal pullup to V3P3; needs a pullup resistor to limit current if pullup voltage is higher than V3P3 |
| FR | 2 | 16 | I | D | Direction control. FR = 0: U→V→W; FR = 1: U→W→V; value is determined by the FR pin state on exit of low-power mode; internal pulldown |
| GND | 7, 16 | 5, 14 | — | — | Digital and analog ground |
| NC | 9 | 8 | — | NC | No internal connection |
| PGND | 10 | 7 | — | P | Power ground connection for motor power |
| PWM | 4 | 2 | I | D | Motor speed-control input; auto detect for analog or digital mode; internal pullup to 2.2 V |
| RMP | 6 | 4 | I | D | Acceleration ramp-rate control; 1/8-W resistor to GND to set acceleration rate; leaving the pin open results in the slowest acceleration rate; the acceleration rate is determined by the RMP pin voltage at power up. |
| U | 11 | 9 | I/O | A | Motor phase U |
| V | 12 | 10 | I/O | A | Motor phase V |
| V1P8 | 5 | 3 | O | P | LDO regulator for internal operation; 1-μF, 6.3-V ceramic capacitor tied to GND. Can supply a maximum of 3 mA to an extenal load. |
| VCC | 14 | 12 | I | P | Power-supply connection; 10-μF, 25-V ceramic capacitor tied to GND |
| VCP | 15 | 13 | O | A | Charge-pump output; 100-nF, 10-V ceramic capacitor tied to VCC |
| W | 13 | 11 | I/O | A | Motor phase W |
| Thermal pad | — | — | — | — | The exposed thermal pad must be electrically connected to the ground plane by soldering to the PCB for proper operation, and connected to the bottom side of the PCB through vias for better thermal spreading. |