5.9.1 Package Thermal Characteristics
Table 5-16 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABZ package.
Table 5-16 Thermal Resistance Characteristics
| NO. |
PARAMETER |
DESCRIPTION |
°C/W(1)(3) |
AIR FLOW (m/s)(2) |
| T1 |
RΘJC |
Junction-to-case |
0.16 |
N/A |
| T2 |
RΘJB |
Junction-to-board |
3.12 |
N/A |
| T3 |
RΘJA |
Junction-to-free air |
13.02 |
0 |
| T4 |
Junction-to-moving air |
7.71 |
1 |
| T5 |
6.76 |
2 |
| T6 |
6.24 |
3 |
| T7 |
ΨJT |
Junction-to-package top |
0.09 |
0 |
| T8 |
0.09 |
1 |
| T9 |
0.09 |
2 |
| T10 |
0.09 |
3 |
| T11 |
ΨJB |
Junction-to-board |
2.88 |
0 |
| T12 |
2.74 |
1 |
| T13 |
2.67 |
2 |
| T14 |
2.61 |
3 |
- These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
- JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
- JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
- JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JESD51-9, Test Boards for Area Array Surface Mount Packages
- m/s = meters per second.
- °C/W = degrees Celsius per watt.