ZHCSEC3F October 2015 – January 2025 DP83867CS , DP83867E , DP83867IS
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | DP83867xS, DP83867E | UNIT | ||
|---|---|---|---|---|
| RGZ (VQFN) | ||||
| 48 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 30.8 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.7 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 7.5 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 7.5 | °C/W | |