ZHCSPA6F September 2006 – January 2022
PRODUCTION DATA
| THERMAL METRIC(1) | BQ2022A | UNIT | ||
|---|---|---|---|---|
| DBZ (3 PINS) | LP (3 PINS) | |||
| RθJA | Junction-to-ambient thermal resistance | 244.3 | 158.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 104.9 | 55.6 | |
| RθJB | Junction-to-board thermal resistance | 93.1 | n/a | |
| ψJT | Junction-to-top characterization parameter | 4.8 | 26.8 | |
| ψJB | Junction-to-board characterization parameter | 66.4 | 137.8 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | |