The RES60A-Q1 is a matched resistive
divider, implemented in thin-film SiCr with Texas Instruments' modern, high-performance,
analog wafer process. A high-quality SiO2 insulative layer encapsulates the resistors
and enables usage at extremely high voltages, up to 1400VDC for sustained operation or
4000VDC for HiPOT testing (60s). The device has a nominal input resistance of RHV =
12.5MΩ, and is available in several nominal ratios to meet a wide array of system needs.
The RES60A-Q1 series features high ratio matching precision, with the measured ratio of
each divider within ±0.1% (maximum) of the nominal. This precision is maintained over
the specified temperature range and aging, with a cumulative drift of only ±0.2%
(maximum). Therefore, the lifetime tolerance of an uncalibrated RES60A-Q1 remains within
a ±0.3% (maximum) envelope. The RES60A-Q1 is automotive qualified under AEC-Q200
temperature grade 1, with a specified temperature range from –40°C to +125°C. The device
is offered in an 8-pin SOIC package, with nominal body size 7.5mm × 5.85mm, and features
creepage and clearance distances of at least 8.5mm between the high-voltage and
low-voltage pins.