Texas Instruments has extensive package characterization capabilities, including an electrical measurements lab with TDR/LRC (Time Domain Reflectometer/inductance resistance capacitance) and network analysis capabilities, a thermal measurements lab with JEDEC standard test conditions up to 1000 watts, and extensive electrical, thermal, and mechanical modeling capability. Modeling was implemented at TI starting in 1984. Stress analysis is done with the Ansys Analysis tool, which provides full linear, nonlinear, 2D and 3D capabilities for solder reliability, package warpage, and stress analysis studies. An internally developed tool ( PACED?) is used for electrical modeling that gives 2.5D and full 3D capability for LRC models, transmission lines, lossy dielectrics, and SPICE deck outputs. The thermal modeling tool was also internally developed ( ThermCAL?) and it provides full 3D automatic mesh generation for most packages.

Complex geometries, transient analysis, and anisotropic materials can be modeled with it. With these capabilities, a full range of modeling from device level through system level can be provided. Package modeling is used to predict package performance at the design stage, to provide a package development tool, to aid qualification by similarity, and as a failure analysis tool.