SPRAA99C March 2008 – May 2021 AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3359 , AM4372 , AM4376 , AM4377 , AM4378 , AM4379 , OMAPL138B-EP , TMUX646
The nFBGA packages have been designed to be consistent with very high-yield assembly processes. Because of their relatively light weight, nFBGA packages tend to self-align during reflow. Since the pitch of the ball pattern is large compared to that of fine-pitch leaded packages, solder bridging is rarely encountered. It is recommended that a high-quality solder joint assembly process be developed using the various inspection and analytical techniques, such as cross-sectioning. Once a quality process has been developed, detailed inspection should not be necessary. Visual methods, while obviously limited, can offer valuable clues to the general stability of the process. Electrical checks can confirm interconnection. Both transmission X-rays and laminographic X-rays have proven to be useful nondestructive tools, if desired.