ZHCSLD2E may 2020 – july 2023 UCC28782
PRODUCTION DATA
| THERMAL METRIC(1) | DEVICE | UNIT | |
|---|---|---|---|
| RTW + Pad (WQFN) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 43.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 31.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 20.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.7 | °C/W |