ZHCSLD2E may 2020 – july 2023 UCC28782
PRODUCTION DATA
The layout techniques described in above sections were applied to the layout of the 65-W USB-PD high-density GaN active clamp flyback converter.
Figure 11-2 Schematic Page 1 of the 65-W EVM
Figure 11-3 Schematic Page 2 of the 65-W EVM
Figure 11-4 Top Assembly and Top (First Layer) of PCB
Figure 11-5 Inner Layer 1 (Second Layer) of PCB
Figure 11-6 Inner Layer 2 (Third Layer) of PCB
Figure 11-7 Bottom Assembly and Bottom (Fourth Layer) of PCB