The Gate resistors RON and
ROFF are sized to reduce ringing caused by parasitic inductances and
capacitances and also to limit the current coming out of the gate driver. For this
design 3Ω RON and 1Ω ROFF resistors were selected.
- RON/ROFF: External gate resistors
- VBOOT: Forward
voltage drop of external bootstrap diode
- VGDF: Forward
voltage drop of external antiparallel diode
- ROL/ROH: Gate driver pulldown/pullup resistance from
datasheet
- RNMOS: Effective
resistance of pullup NMOS in hybrid structure
- RG_int: Power
transistor internal gate resistance, found in power transistor
datasheet
Maximum HO Drive Current
(IHO(src)):
Equation 8.
Maximum HO Sink Current
(IHO(sk)):
Equation 9.
Maximum LO Drive Current
(ILO(src)):
Equation 10.
Maximum LO Sink Current
(ILO(sk)):
Equation 11.
The external gate driver resistors,
RON and ROFF, are used to:
- Limit ringing caused by
parasitic inductances/capacitances in the gate drive loop.
- Limit ringing caused by high
voltage/current switching dV/dt, dI/dt, and body-diode reverse
recovery.
- Fine-tune gate drive
strength, for example peak sink and source current to optimize the switching
loss.
- Reduce electromagnetic
interference (EMI) related to switching.