SLUSFU6 September 2025 UCC27834-Q1
PRODMIX
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
-
7 Application and Implementation
- 7.1 Application Information
- 7.2
Typical Application
- 7.2.1 Design Requirements
- 7.2.2
Detailed Design Procedure
- 7.2.2.1 Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
- 7.2.2.2 Selecting Bootstrap Capacitor (CBOOT)
- 7.2.2.3 Selecting VDD Bypass Capacitor (CVDD)
- 7.2.2.4 Selecting Bootstrap Resistor (RBOOT)
- 7.2.2.5 Selecting Gate Resistor RON/ROFF
- 7.2.2.6 Selecting Bootstrap Diode
- 7.2.2.7 Estimate the UCC278X4-Q1 Power Losses
- 7.2.3 Application Curves
- 7.3 Power Supply Recommendations
- 7.4 Layout
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- D|8
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
8.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |