ZHCSQE6 October 2023 UCC27332-Q1
PRODUCTION DATA
| THERMAL METRIC | UCC27332-Q1 | UNIT | |
|---|---|---|---|
| DGN (MSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 57.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 82.0 | |
| RθJB | Junction-to-board thermal resistance | 30.5 | |
| ψJT | Junction-to-top characterization parameter | 5.0 | |
| ψJB | Junction-to-board characterization parameter |
30.4 |
|
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 13.1 | |