ZHCSKA3D September 2019 – November 2023 UCC21750-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC21750-Q1 | UNIT | |
|---|---|---|---|
| DW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 68.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 27.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 32.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 14.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 32.3 | °C/W |