ZHCSBM1D September 2013 – August 2024 TS3USB3031
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
- Parameter Measurement Information
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RMG|12
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5.7 Typical Characteristics
Figure 5-1 ON-Resistance vs VI/O for MHL Switch
Figure 5-3 Bandwidth for MHL Switch
Figure 5-2 ON-Resistance vs VI/O for USB Switch
Figure 5-4 Bandwidth for USB Switch
Figure 5-5 OFF Isolation vs Frequency for MHL Path
Figure 5-7 Cross Talk vs Frequency for MHL Path
Figure 5-6 OFF Isolation vs Frequency for USB Path
Figure 5-8 Cross Talk vs Frequency for USB Path