ZHCSDQ2C January 2015 – September 2018 TPS7B7701-Q1 , TPS7B7702-Q1
PRODUCTION DATA.
For the layout of TPS7B770x-Q1 device, place the input and output capacitors close to the device as shown in Figure 25. To enhance the thermal performance, TI recommends surrounding the device with some vias.
Minimize equivalent-series inductance (ESL) and ESR to maximize performance and provide stability. Place every capacitor as close as possible to the device and on the same side of the PCB as the regulator.
Do not place any of the capacitors on the opposite side of the PCB from where the regulator is installed. TI strongly discourages the use long traces because they can negatively impact system performance and cause instability.
If possible, and to maintain the maximum performance specified in this device data sheet, use the same layout pattern used for the TPS7B770x-Q1 evaluation board, available online at www.ti.com/tool/TPS7B7702EVM.