ZHCSDQ2C January 2015 – September 2018 TPS7B7701-Q1 , TPS7B7702-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Fault Detection and Protection
- 7.3.2 Short-Circuit and Overcurrent Protection
- 7.3.3 Short-to-Battery and Reverse Current Detection
- 7.3.4 Thermal Shutdown
- 7.3.5 Integrated Reverse-Polarity Protection
- 7.3.6 Integrated Inductive Clamp
- 7.3.7 Undervoltage Lockout
- 7.3.8 Enable (EN, EN1, and EN2)
- 7.3.9 Internal Voltage Regulator (VCC)
- 7.3.10 Current Sense Multiplexing
- 7.3.11 Adjustable Output Voltage (FB, FB1, and FB2)
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|16
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|16
訂購(gòu)信息
8.2 Typical Application
Figure 22 shows the typical application circuit for the TPS7B770x-Q1 family of devices. Different values of external components can be used depending on the end application. An application can require a larger output capacitor during fast load steps to prevent large drops on output voltage. TI recommends a low-ESR ceramic capacitor with a dielectric of type X5R or X7R.
Figure 22. TPS7B770x-Q1 Typical Application