ZHCSHE2B September 2017 – June 2018 TPS7A52-Q1
PRODUCTION DATA.
For best overall performance, place all circuit components on the same side of the circuit board and as near as practical to the respective LDO pin connections. Place ground return connections to the input and output capacitor, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side, copper surface. To avoid negative system performance, do not use of vias and long traces to the input and output capacitors. The grounding and layout scheme provided in Figure 50 minimizes inductive parasitics, and thereby reduces load-current transients, minimizes noise, and increases circuit stability.
To improve performance, use a ground reference plane, either embedded in the PCB itself or placed on the bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output voltage, shield noise, and behaves similar to a thermal plane to spread (or sink) heat from the LDO device when connected to the thermal pad. In most applications, this ground plane is necessary to meet thermal requirements.