ZHCSFL8C October 2016 – August 2021 TPS65983B
PRODUCTION DATA
The TPS65983B has both a central thermal shutdown to the chip and a local thermal shutdown for the power path block. The central thermal shutdown monitors the temperature of the center of the die and disables all functions except for supervisory circuitry and halts digital core when die temperature goes above a rising temperature of TSD_MAIN. The temperature shutdown has a hysteresis of TSDH_MAIN and when the temperature falls back below this value, the device resumes normal operation. The power path block has its own local thermal shutdown circuit to detect an over temperature condition due to over current and quickly turn off the power switches. The power path thermal shutdown values are TSD_PWR and TSDH_PWR. The output of the thermal shutdown circuit is deglitched by TSD_DG before triggering. The thermal shutdown circuits interrupt to the digital core.