ZHCSI09S June   2010  – August 2018 TPS65911

PRODUCTION DATA.  

1. 1器件概述
   1. 1.1 特性
   2. 1.2 應用
   3. 1.3 說明
   4. 1.4 功能方框圖
2. 2修訂歷史記錄
3. 3Device Comparison Table
4. 4Pin Configuration and Functions
   1. 4.1 Pin Attributes
      1.      Pin Attributes
5. 5Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Thermal Information
   5. 5.5  Electrical Characteristics: I/O Pullup and Pulldown
   6. 5.6  Electrical Characteristics: Digital I/O Voltage
   7. 5.7  Electrical Characteristics: Power Consumption
   8. 5.8  Electrical Characteristics: Power References and Thresholds
   9. 5.9  Electrical Characteristics: Thermal Monitoring and Shutdown
   10. 5.10 Electrical Characteristics: 32-kHz RTC Clock
   11. 5.11 Electrical Characteristics: Backup Battery Charger
   12. 5.12 Electrical Characteristics: VRTC LDO
   13. 5.13 Electrical Characteristics: VIO SMPS
   14. 5.14 Electrical Characteristics: VDD1 SMPS
   15. 5.15 Electrical Characteristics: VDD2 SMPS
   16. 5.16 Electrical Characteristics: VDDCtrl SMPS
   17. 5.17 Electrical Characteristics: LDO1 and LDO2
   18. 5.18 Electrical Characteristics: LDO3 and LDO4
   19. 5.19 Electrical Characteristics: LDO5
   20. 5.20 Electrical Characteristics: LDO6, LDO7, and LDO8
   21. 5.21 Timing and Switching Characteristics
       1. 5.21.1 I2C Timing and Switching
       2. 5.21.2 Switch-ON and Switch-OFF Sequences and Timing
       3. 5.21.3 Power Control Timing
          1. 5.21.3.1 Device State Control Through PWRON Signal
          2. 5.21.3.2 Device SLEEP State Control
          3. 5.21.3.3 Device Turnon and Turnoff With Rising and Falling Input Voltage
          4. 5.21.3.4 Power Supplies State Control Through EN1 and EN2 Signals
          5. 5.21.3.5 VDD1, VDD2 Voltage Control Through EN1 and EN2 Signals
6. 6Detailed Description
   1. 6.1  Overview
   2. 6.2  Functional Block Diagram
   3. 6.3  Power Reference
   4. 6.4  Power Resources
   5. 6.5  Embedded Power Controller (EPC)
      1. 6.5.1 State Machine
         1. 6.5.1.1 Device POWER ON Enable Conditions
         2. 6.5.1.2 Device POWER ON Disable Conditions
         3. 6.5.1.3 Device SLEEP Enable Conditions
         4. 6.5.1.4 Device Reset Scenarios
      2. 6.5.2 BOOT Configuration, Switch-ON, and Switch-OFF Sequences
      3. 6.5.3 Control Signals
         1. 6.5.3.1  SLEEP
         2. 6.5.3.2  PWRHOLD
         3. 6.5.3.3  BOOT1
         4. 6.5.3.4  NRESPWRON, NRESPWRON2
         5. 6.5.3.5  CLK32KOUT
         6. 6.5.3.6  PWRON
         7. 6.5.3.7  INT1
         8. 6.5.3.8  EN2 and EN1
         9. 6.5.3.9  GPIO0 to GPIO8
         10. 6.5.3.10 HDRST Input
         11. 6.5.3.11 PWRDN
         12. 6.5.3.12 Comparators: COMP1 and COMP2
         13. 6.5.3.13 Watchdog
         14. 6.5.3.14 Tracking LDO
   6. 6.6  PWM and LED Generators
   7. 6.7  Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation
   8. 6.8  32-kHz RTC Clock
   9. 6.9  Real Time Clock (RTC)
      1. 6.9.1 Time Calendar Registers
      2. 6.9.2 General Registers
      3. 6.9.3 Compensation Registers
   10. 6.10 Backup Battery Management
   11. 6.11 Backup Registers
   12. 6.12 I2C Interface
       1. 6.12.1 Access Protocols
          1. 6.12.1.1 Single Byte Access
          2. 6.12.1.2 Multiple Byte Access to Several Adjacent Registers
   13. 6.13 Thermal Monitoring and Shutdown
   14. 6.14 Interrupts
   15. 6.15 Register Maps
       1. 6.15.1 Functional Registers
          1. 6.15.1.1 TPS65911_FUNC_REG Registers Mapping Summary
          2. 6.15.1.2 TPS65911_FUNC_REG Register Descriptions
7. 7Applications, Implementation, and Layout
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
         1. 7.2.2.1 External Component Recommendation
         2. 7.2.2.2 Controller Design Procedure
            1. 7.2.2.2.1 Inductor Selection
            2. 7.2.2.2.2 Selecting the RTRIP Resistor
            3. 7.2.2.2.3 Selecting the Output Capacitors
            4. 7.2.2.2.4 Selecting FETs
            5. 7.2.2.2.5 Bootstrap Capacitor
            6. 7.2.2.2.6 Selecting Input Capacitors
         3. 7.2.2.3 Converter Design Procedure
            1. 7.2.2.3.1 Selecting the Inductor
            2. 7.2.2.3.2 Selecting Output Capacitors
            3. 7.2.2.3.3 Selecting Input Capacitors
      3. 7.2.3 Application Curves
      4. 7.2.4 Layout Guidelines
         1. 7.2.4.1 PCB Layout
      5. 7.2.5 Layout Example
   3. 7.3 Power Supply Recommendations
8. 8器件和文檔支持
   1. 8.1 器件支持
      1. 8.1.1 開發(fā)支持
      2. 8.1.2 器件命名規(guī)則
   2. 8.2 文檔支持
      1. 8.2.1 相關文檔
   3. 8.3 接收文檔更新通知
   4. 8.4 社區(qū)資源
      1. 8.4.1 社區(qū)資源
   5. 8.5 商標
   6. 8.6 靜電放電警告
   7. 8.7 術(shù)語表
9. 9機械、封裝和可訂購信息
   1. 9.1 封裝 說明