ZHCSLA4E May 2020 – October 2024 TPS61378-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 VCC Power Supply
- 7.3.2 Input Undervoltage Lockout (UVLO)
- 7.3.3 Enable and Soft Start
- 7.3.4 Shut Down
- 7.3.5 Switching Frequency Setting
- 7.3.6 Spread Spectrum Frequency Modulation
- 7.3.7 Adjustable Peak Current Limit
- 7.3.8 Bootstrap
- 7.3.9 Load Disconnect
- 7.3.10 MODE/SYNC Configuration
- 7.3.11 Overvoltage Protection (OVP)
- 7.3.12 Output Short Protection/Hiccup
- 7.3.13 Power-Good Indicator
- 7.3.14 Thermal Shutdown
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2 Detailed Design Procedure
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Revision History
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RTE|16
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RTE|16
訂購信息
11.6 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數(shù)更改都可能會導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |