ZHCSGO0A June 2017 – February 2024 TPS549B22
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3 Feature Description
- 6.4 Device Functional Modes
- 6.5 Programming
-
7 Register Maps
- 7.1 OPERATION Register (address = 1h)
- 7.2 ON_OFF_CONFIG Register (address = 2h)
- 7.3 CLEAR FAULTS (address = 3h)
- 7.4 WRITE PROTECT (address = 10h)
- 7.5 STORE_DEFAULT_ALL (address = 11h)
- 7.6 RESTORE_DEFAULT_ALL (address = 12h)
- 7.7 CAPABILITY (address = 19h)
- 7.8 VOUT_MODE (address = 20h)
- 7.9 VOUT_COMMAND (address = 21h)
- 7.10 VOUT_MARGIN_HIGH (address = 25h) ?
- 7.11 VOUT_MARGIN_LOW (address = 26h)
- 7.12 STATUS_BYTE (address = 78h)
- 7.13 STATUS_WORD (High Byte) (address = 79h)
- 7.14 STATUS_VOUT (address = 7Ah)
- 7.15 STATUS_IOUT (address = 7Bh)
- 7.16 STATUS_CML (address = 7Eh)
- 7.17 MFR_SPECIFIC_00 (address = D0h)
- 7.18 MFR_SPECIFIC_01 (address = D1h)
- 7.19 MFR_SPECIFIC_02 (address = D2h)
- 7.20 MFR_SPECIFIC_03 (address = D3h)
- 7.21 MFR_SPECIFIC_04 (address = D4h)
- 7.22 MFR_SPECIFIC_06 (address = D6h)
- 7.23 MFR_SPECIFIC_07 (address = D7h)
- 7.24 MFR_SPECIFIC_44 (address = FCh)
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1 TPS549B22 1.5-V to 18-V Input, 1-V Output, 25-A Converter
- 8.2.2 Design Requirements
- 8.2.3
Detailed Design Procedure
- 8.2.3.1 Custom Design With WEBENCH? Tools
- 8.2.3.2 Switching Frequency Selection
- 8.2.3.3 Inductor Selection
- 8.2.3.4 Output Capacitor Selection
- 8.2.3.5 Input Capacitor Selection
- 8.2.3.6 Bootstrap Capacitor Selection
- 8.2.3.7 BP Pin
- 8.2.3.8 R-C Snubber and VIN Pin High-Frequency Bypass
- 8.2.3.9 Optimize Reference Voltage (VSEL)
- 8.2.3.10 MODE Pin Selection
- 8.2.3.11 ADDR Pin Selection
- 8.2.3.12 Overcurrent Limit Design
- 8.2.4 Application Curves
- 8.3 Power Supply Recommendations
- 8.4 Layout
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- RVF|40
散熱焊盤機械數據 (封裝 | 引腳)
- RVF|40
訂購信息
8.4.3 Mounting and Thermal Profile Recommendation
Proper mounting technique adequately covers the exposed thermal tab with solder. Excessive heat during the reflow process can affect electrical performance. Figure 8-16 shows the recommended reflow oven thermal profile. Proper post-assembly cleaning is also critical to device performance. See
QFN/SON PCB Attachment for more information.
Figure 8-16 Recommended Reflow Oven Thermal ProfileTable 8-4 Recommended Thermal Profile Parameters
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RAMP UP AND RAMP DOWN | |||||
| rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
| rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
| PRE-HEAT | |||||
| TS | Pre-heat temperature | 150 | 200 | °C | |
| tS | Pre-heat time, TS(min) to TS(max) | 60 | 180 | s | |
| REFLOW | |||||
| TL | Liquids temperature | 217 | °C | ||
| TP | Peak temperature | 260 | °C | ||
| tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
| tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
| t25P | Total time from 25°C to peak temperature, TP | 480 | s | ||