ZHCSNR4B May   2021  – April 2022 TPS25946

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Timing Requirements
   7. 7.7 Switching Characteristics
      1.      15
   8. 7.8 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 8.3.2 Overvoltage Lockout (OVLO)
      3. 8.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
         1. 8.3.3.1 Slew Rate (dVdt) and Inrush Current Control
         2. 8.3.3.2 Active Current Limiting
         3. 8.3.3.3 Short-Circuit Protection
      4. 8.3.4 Analog Load Current Monitor
      5. 8.3.5 Reverse Current Protection
      6. 8.3.6 Overtemperature Protection (OTP)
      7. 8.3.7 Fault Response and Indication (FLT)
      8. 8.3.8 Power Good Indication (PG)
      9. 8.3.9 Input Supply Good Indication (SPLYGD)
   4. 8.4 Device Functional Modes
9. 9 Application and Implementation
   1. 9.1 Application Information
      1. 9.1.1 Single Device, Self-Controlled
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 Device Selection
         2. 9.2.2.2 Setting Overvoltage Threshold
         3. 9.2.2.3 Setting Output Voltage Rise Time (tR)
         4. 9.2.2.4 Setting Power Good Assertion Threshold
         5. 9.2.2.5 Setting Overcurrent Threshold (ILIM)
         6. 9.2.2.6 Setting Overcurrent Blanking Interval (tITIMER)
         7. 9.2.2.7 Selecting External Bias Resistor (R5)
         8. 9.2.2.8 Selecting External Diode (D1)
      3. 9.2.3 Application Curve
10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 Documentation Support
       1. 12.1.1 Related Documentation
    2. 12.2 接收文檔更新通知
    3. 12.3 支持資源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 術(shù)語(yǔ)表
13. 13Mechanical, Packaging, and Orderable Information