ZHCSNC9C february 2021 – july 2023 TMUX7308F , TMUX7309F
PRODUCTION DATA
| THERMAL METRIC(1) | TMUX7308F/ TMUX7309F | UNIT | ||
|---|---|---|---|---|
| PW (TSSOP) | RRP (QFN) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 100.4 | 43.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 31.3 | 28.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.4 | 17.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.7 | 0.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 45.8 | 17.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 4.2 | °C/W |