ZHCSLO9F July 2020 – July 2024 TMUX7208 , TMUX7209
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Thermal Information
- 6.4 Recommended Operating Conditions
- 6.5 Source or Drain Continuous Current
- 6.6 ±15 V Dual Supply: Electrical Characteristics?
- 6.7 ±15 V Dual Supply: Switching Characteristics?
- 6.8 ±20 V Dual Supply: Electrical Characteristics
- 6.9 ±20 V Dual Supply: Switching Characteristics
- 6.10 44 V Single Supply: Electrical Characteristics?
- 6.11 44 V Single Supply: Switching Characteristics?
- 6.12 12 V Single Supply: Electrical Characteristics?
- 6.13 12 V Single Supply: Switching Characteristics?
- 6.14 Typical Characteristics
-
7 Parameter Measurement Information
- 7.1 On-Resistance
- 7.2 Off-Leakage Current
- 7.3 On-Leakage Current
- 7.4 Transition Time
- 7.5 tON(EN) and tOFF(EN)
- 7.6 Break-Before-Make
- 7.7 tON (VDD) Time
- 7.8 Propagation Delay
- 7.9 Charge Injection
- 7.10 Off Isolation
- 7.11 Crosstalk
- 7.12 Bandwidth
- 7.13 THD + Noise
- 7.14 Power Supply Rejection Ratio (PSRR)
- 8 Detailed Description
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Revision History
- 12Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- RUM|16
訂購信息
7.6 Break-Before-Make
Break-before-make delay is a safety feature that prevents two inputs from connecting when the device is switching. The output first breaks from the on-state switch before making the connection with the next on-state switch. The time delay between the break and the make is known as break-before-make delay. Figure 7-6 shows the setup used to measure break-before-make delay, denoted by the symbol tOPEN(BBM).
Figure 7-6 Break-Before-Make
Delay Measurement Setup