11 Revision History
Changes from Revision E (January 2022) to Revision F (July 2024)
- Increased HBM ESD rating of TMUX7209 PW packageGo
- Increased HBM ESD rating of RUM packagesGo
- Updated IIH max spec from 1.2uA to 2uAGo
Changes from Revision D (September 2021) to Revision E (January 2022)
- Updated the Truth Tables sectionGo
Changes from Revision C (April 2021) to Revision D (September 2021)
- 將 TMXU7208 和 TMUX7209 的 QFN 封裝狀態從預發布 更改為正在供貨
Go
- Added ESD detail for RUM packageGo
- Added the Integrated Pull-Down Resistor on Logic Pins
sectionGo
- Updated the Ultra-Low Charge Injection
sectionGo
- Updated the
TMUX720x Layout Example figures in the Layout
Example sectionGo
Changes from Revision B (April 2021) to Revision C (April 2021)
- Added ESD detail for TMUX7209Go
Changes from Revision A (March 2021) to Revision B (April 2021)
Changes from Revision * (December 2020) to Revision A (March 2021)
- 向“特性”部分添加了對 WQFN 的高電流支持Go
- Added thermal information for QFN packageGo
- Added IDC specs for QFN package in Source or Drain Continuous Current table Go
- Updated VDD rise time value from 100ns to 1μs in TON(VDD) test conditionGo
- Updated CL value from 1nF to 100pF in Charge Injection test conditionGo