ZHCSIX6B October 2018 – Sept 2019 TMUX1574
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Parameter Measurement Information
- 7.1 On-Resistance
- 7.2 Off-Leakage Current
- 7.3 On-Leakage Current
- 7.4 IPOFF Leakage Current
- 7.5 Transition Time
- 7.6 tON (EN) and tOFF (EN) Time
- 7.7 tON (VDD) and tOFF (VDD) Time
- 7.8 Break-Before-Make Delay
- 7.9 Propagation Delay
- 7.10 Skew
- 7.11 Charge Injection
- 7.12 Capacitance
- 7.13 Off Isolation
- 7.14 Channel-to-Channel Crosstalk
- 7.15 Bandwidth
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RSV|16
訂購信息
9.2 Typical Application
Common applications that require the features of the TMUX1574 include multiplexing various protocols from a possessor or MCU such as SPI, JTAG, or standard GPIO signals. The TMUX1574 provides superior isolation performance when the device is powered. The added benefit of powered-off protection allows a system to minimize complexity by eliminating the need for power sequencing in hot-swap and live insertion applications. The example shown in Figure 42 illustrates the use of the TMUX1574 to multiplex an SPI bus to multiple flash memory devices.
Figure 42. Multiplexing Flash Memory