ZHCSIX6B October 2018 – Sept 2019 TMUX1574
PRODUCTION DATA.
| THERMAL METRIC(1) | DEVICE | DEVICE | DEVICE | UNIT | |
|---|---|---|---|---|---|
| PW (TSSOP) | DYY (SOT-23) | RSV (UQFN) | |||
| 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 117.4 | 123.0 | 129.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.9 | 70.5 | 69.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 63.7 | 50.4 | 58.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 6.9 | 5.0 | 3.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 63.1 | 50.3 | 56.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |