ZHCSIN2C August 2018 – December 2018 TMUX1208 , TMUX1209
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics (VDD = 5 V ±10 %)
- 7.6 Electrical Characteristics (VDD = 3.3 V ±10 %)
- 7.7 Electrical Characteristics (VDD = 1.8 V ±10 %)
- 7.8 Electrical Characteristics (VDD = 1.2 V ±10 %)
- 7.9 Typical Characteristics
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSV|16
訂購信息
8.1.1 On-Resistance
The on-resistance of a device is the ohmic resistance between the source (Sx) and drain (D) pins of the device. The on-resistance varies with input voltage and supply voltage. The symbol RON is used to denote on-resistance. The measurement setup used to measure RON is shown below. Voltage (V) and current (ISD) are measured using this setup, and RON is computed as shown in Figure 7 with RON = V / ISD:
Figure 7. On-Resistance Measurement Setup