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ZHCSCD2B April 2014 – August 2014 TMP75B

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

D|8
- MSOI002K
DGK|8
- MPDS028E

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

		MIN	MAX	UNIT
Supply voltage, V_S			4	V
Input voltage	SDA, SCL, ALERT, A2, A1	-0.3	4	V
Input voltage	A0	-0.3	(V_S) + 0.3	V
Sink current	SDA, ALERT		10	mA
Operating junction temperature		-55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

			MIN	MAX	UNIT
T_stg	Storage temperature range		-60	150	°C
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	–2000	2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	–1000	1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
Supply voltage		1.4	1.8	3.6	V
Operating free-air temperature, T_A		-55		125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TMP75B		UNIT
		D (SOIC)	DGK (VSSOP)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	125.4	188.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	71.5	79.1
R_θJB	Junction-to-board thermal resistance	65.8	109.6
ψ_JT	Junction-to-top characterization parameter	21.1	15.3
ψ_JB	Junction-to-board characterization parameter	65.3	108
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At T_A = –55°C to +125°C and V_S = +1.4 V to +3.6 V, unless otherwise noted. Typical values at T_A = 25°C and V_S = +1.8 V.

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
TEMPERATURE INPUT
	Temperature range		–55		+125	°C
	Temperature resolution			0.0625		°C
	Temperature accuracy (error)	–20°C to +85°C		±0.5	±2	°C
	Temperature accuracy (error)	–55°C to +125°C		±1	±3	°C
DIGITAL INPUT/OUTPUT
V_IH	High-level input voltage		0.7(V_S)		V_S	V
V_IL	Low-level input voltage		-0.3		0.3(V_S)	V
I_IN	Input current	0 V < V_IN < (V_S) + 0.3 V			1	μA
V_OL	Low-level output voltage	V_S ≥ 2 V, I_OUT = 3 mA			0.4	V
V_OL	Low-level output voltage	V_S < 2 V, I_OUT = 3 mA			0.2(V_S)	V
	ADC resolution			12		Bit
	Conversion time	One-shot mode	20	27	35	ms
	Conversion modes	CR1 = 0, CR0 = 0 (default)		37		Conv/s
		CR1 = 0, CR0 = 1		18		Conv/s
		CR1 = 1, CR0 = 0		9		Conv/s
		CR1 = 1, CR0 = 1		4		Conv/s
	Timeout time		38	54	70	ms
POWER SUPPLY
	Operating supply range		1.4		3.6	V
I_Q	Quiescent current	Serial bus inactive, CR1 = 0, CR0 = 0 (default)		45	89	μA
		Serial bus inactive, CR1 = 0, CR0 = 1		22	48	μA
		Serial bus inactive, CR1 = 1, CR0 = 0		12	30	μA
		Serial bus inactive, CR1 = 1, CR0 = 1		6.5	21	μA
I_SD	Shutdown current	Serial bus inactive		0.3	8	μA
		Serial bus active, SCL frequency = 400 kHz		10		μA
		Serial bus active, SCL frequency = 3.4 MHz		80		μA

6.6 Typical Characteristics

At T_A = 25°C and V_S = +1.8 V (unless otherwise noted).

Figure 1. Quiescent Current vs Temperature

Figure 3. Conversion Time vs Temperature

Figure 5. Temperature Error vs Temperature

Figure 2. Shutdown Current vs Temperature

Figure 4. Quiescent Current vs Bus Frequency

Figure 6. Temperature Error at 25°C