ZHCSMZ5D April 2020 – January 2023 TLV841
PRODUCTION DATA
| THERMAL METRIC(1) | TLV841 | UNIT | |
|---|---|---|---|
| YBH (WCSP) | |||
| 4 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 180.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 58.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |