ZHCSMJ5F june 2010 – december 2020 TLV809
PRODUCTION DATA
| THERMAL METRIC(1) | TLV809 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | DBZ (SOT-23) | |||
| 3 PINS | 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 242.1 | 286.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 213.0 | 105.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 123.4 | 124.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 45.7 | 25.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 130.9 | 107.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |