ZHCSHL6B September 2017 – November 2019 TAS5760M-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TAS5760M-Q1 | UNIT | ||
|---|---|---|---|---|
| DAP [HTSSOP] | DAP [HTSSOP] | |||
| 32-PIN(2) | 32-PIN(3) | |||
| θJA | Junction-to-ambient thermal resistance | 60.3 | 31.9 | °C/W |
| θJC(top) | Junction-to-case (top) thermal resistance | 16 | 16 | °C/W |
| θJB | Junction-to-board thermal resistance | 12 | 17 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 11.9 | 16.8 | °C/W |
| θJC(bottom) | Junction-to-case (bottom) thermal resistance | 0.8 | 0.81 | °C/W |