ZHCSJ69A October 2018 – December 2018 TAS2562
PRODUCTION DATA.
The TAS2562 monitors the die temperature and can automatically limit the audio signal when the die temperature reaches a set threshold. It is recommended to use PurePath™ Console 3 Software to configure the thermal foldback as the software will perform the necessary math for each register.
Thermal foldback can be disabled using TF_EN. If the die temperature reaches TF_TEMP_TH this feature will begin to attenuate the audio signal to prevent the device from shutting down due to over-temperature. It will attenuate the audio signal by TF_LIMS db per degree of temperature over TF_TEMP_TH. The thermal foldback with attack at a fixed rate of 0.25dB per sample. A maximum attenuation of TF_MAX_ATTN can be specified. However if the device continue to heat up eventually the device over-temperature will be triggered. The attenuation will be held for TF_HOLD_CNT samples before the attenuation will begin releasing.
| TF_EN | Setting |
|---|---|
0
|
Disabled |
1
|
Enabled (default) |
| Register | Description | Calculation |
|---|---|---|
TF_LIMS
|
Thermal foldback limiter slope (in db/°C) | round(10^(-slope / 20)*2^31) |
TF_HOLD_CNT
|
Thermal foldback hold count (samples) | round(seconds * 1000) |
TF_REL_RATE
|
Thermal foldback limiter release rate (db/samples) | round(10^(dB per sample / 20)*2^30) |
TF_TEMP_TH
|
Thermal foldback limiter temperature threshold (°C) | round(°C * 2^23) |
TF_MAX_ATTN
|
Thermal foldback max gain reduction (dB) | round(10^(max attn dB/20)*2^31) |